Darrel R. Frear,
Steven N. Burchett,
Harold S. Morgan,
John H. Lau
e.a.
Mechanics of Solder Alloy Interconnects
Gebonden Engels 1994 1994e druk 9780442015053
Verwachte levertijd ongeveer 9 werkdagen
Samenvatting
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
Specificaties
ISBN13:9780442015053
Taal:Engels
Bindwijze:gebonden
Aantal pagina's:418
Uitgever:Springer US
Druk:1994
Hoofdrubriek:Programmeren, Computer en informatica
Lezersrecensies
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Inhoudsopgave
Foreword; Acknowldgement; Introduction: the mechanics of soldere alloy interconnect; Microstructural influences on the mechanical properties of solder; Interfaces and intermetallics; Constitutivemodels; Prediction of solder joint geometry; Life prediction and accelerated testing; Thermomechanical modeling of solder joints - numerical considerations; Applications - through-hole; Surface mount solder joints under thermal, mechanical, and vibration conditions; Index
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